| Предназначен за | Охлаждащи системи |
| Х-ка 2 | TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. |
| Х-ка 3 | The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs. |
| Х-ка 4 | Density: 2.55 g/cm3 |
| Х-ка 5 | Viscosity: 76 Pa-s |
| Х-ка 6 | Thermal impedance: 0.185°C -in2/W |
| Х-ка 7 | Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs. |
| Х-ка 8 | The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system. |
Availability:
Limited
Brand:
Thermaltake
