| Предназначен за | Охлаждащи системи |
| Х-ка 2 | TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. |
| Х-ка 3 | With a thermal conductivity of 8.0 W/m-k, the thermal compound also contains diamonds powder allowing users to pursue a higher heat transfer rate. |
| Х-ка 4 | Density: 2.9 g/cm3 |
| Х-ка 5 | Viscosity: 47 Pa-s |
| Х-ка 6 | Thermal impedance: 0.035°C -in2/W |
| Х-ка 7 | Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs. |
| Х-ка 8 | This thermal compound application kit includes a set of easily-applied tools for immediate use. |
Availability:
Limited
Brand:
Thermaltake
